CompuServe Thread

#Why SMD

4 messages in this thread
#174206From: James R. OllickNov 25, 1994 8:17 PM
From what I have come to understand, the reason for surface mount technology is due to capacidence that is created by the soldered devices (resisters, IC sockets etc.) leads, (the length of the pigtails) that is needed by using flow solder techniques, can not be tolerated at high bus speeds. Jim R. Ollick Using AP from Bergenfield, NJ
#174230From: Don Curtis/SYSOPNov 26, 1994 12:35 AM
James, I don't know about the electrical effects, but my understanding of surface mount technology is that there are two main reasons for it: 1. Higher parts density. Surface mounts parts are smaller and the spaces between parts can be smaller because no leads on resistors and capacitors and chips. 2. Cheaper to automate filling the board with parts. Don
#174254From: Mr. ChalleronNov 26, 1994 3:26 AM
And (2) more-so than (1); I work for a company that builds communica- tions systems, and we've just bought our second SMD machine (a HUGE Pana-Sert) … and we DIDN'T get it for "higher parts density"…. "A 'Creative Amiga'? Hell, we ALL knew that…." Mr. C
#174302From: Rick GreenNov 26, 1994 12:44 PM
There is also the fact that SMD do not come loose in their sockets 🙂 Rick Green Via AutoPilot